SEMICONDUCTOR DEVICE, DYNAMIC QUANTITY MEASURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

This semiconductor device is provided with: a metal body; a bonding layer arranged on the metal body; and a semiconductor chip arranged on the bonding layer. The bonding layer comprises: a first layer that is formed between the metal body and the semiconductor chip and contains a filler; and a second layer that is bonded to the first layer and the semiconductor chip and has a higher thermal expansion coefficient than the first layer.