发明名称 METHOD FOR SEAMLESSLY COUPLING FABRIC USING BONDING PATTERN LINE FORMED BY HIGH-FREQUENCY BONDING TECHNIQUE
摘要 According to the present invention, it is possible to seamlessly couple fabrics by forming a pattern bonding line by: printing a thermally reactive adhesive in a predetermined printing pattern on the inner surface of inner-wear and/or outer-wear or on an arbitrary reinforcing member and drying the adhesive; laminating the inner-wear, the arbitrary reinforcing member, and the outer-wear mentioned above; and bonding the inner-wear and the outer-wear with the adhesive through high-frequency heating while pressing the same in a pressing pattern that is the same as the aforementioned printing pattern. According to the present invention, by using a high-frequency bonding technique using a thermally reactive adhesive, it is possible to seamlessly couple fabrics by a bonding pattern line that is made up of a bonding line with excellent adhesive force and durability and a pattern line with a good aesthetic impression thanks to the excellent clarity and finishing quality thereof.
申请公布号 WO2017007219(A1) 申请公布日期 2017.01.12
申请号 WO2016KR07261 申请日期 2016.07.05
申请人 HOJEON LIMITED 发明人 PARK, Young Chul
分类号 D06H5/00;D06C23/00;D06M17/00 主分类号 D06H5/00
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