RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

Provided is a resin composition having excellent moldability and which is a raw material for a printed wiring board which has excellent heat resistance after moisture absorption. The resin composition includes: a maleimide compound; a silane compound which has a carbon-carbon unsaturated bond and either a hydrolyzable group or a hydroxyl group; a silane compound which has an epoxy backbone and either a hydrolyzable group or a hydroxyl group; and an inorganic filler.