发明名称 OPTOELECTRONIC MODULES INCLUDING OVERMOLD SUPPORTING AN OPTICAL ASSEMBLY
摘要 Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer- level fabrication methods for making the modules.
申请公布号 WO2017007425(A1) 申请公布日期 2017.01.12
申请号 WO2016SG50304 申请日期 2016.06.29
申请人 HEPTAGON MICRO OPTICS PTE. LTD. 发明人 CHAN, Sai Mun;RUDMANN, Hartmut;AHN, Tae Yong;HWANG, Kyu Won
分类号 H01L21/00;H01L23/28;H01L31/00 主分类号 H01L21/00
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