发明名称 |
OPTOELECTRONIC MODULES INCLUDING OVERMOLD SUPPORTING AN OPTICAL ASSEMBLY |
摘要 |
Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer- level fabrication methods for making the modules. |
申请公布号 |
WO2017007425(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
WO2016SG50304 |
申请日期 |
2016.06.29 |
申请人 |
HEPTAGON MICRO OPTICS PTE. LTD. |
发明人 |
CHAN, Sai Mun;RUDMANN, Hartmut;AHN, Tae Yong;HWANG, Kyu Won |
分类号 |
H01L21/00;H01L23/28;H01L31/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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