| 摘要 |
[Problem] To provide a high frequency module, which has a simple structure, and contributes to the size reduction of a device. [Solution] Disclosed is a high frequency module 100 that is provided with a wiring board 10, and an antenna substrate 20 disposed on the upper surface of the wiring board 10. On the antenna substrate 20, an antenna 21 is formed using a metal pattern 21a, a non-conductive adhesive 11 and a conductive adhesive 13 are present between the wiring board 10 and the antenna substrate 20, and a spacer 23 is provided between the non-conductive adhesive 11 and the conductive adhesive 13. Consequently, the non-conductive adhesive 11 and the conductive adhesive 13 are prevented from being in contact with each other by means of the spacer 23, and a necessary height between the wiring board 10 and the antenna substrate 20 can be ensured. Furthermore, the wiring board 10 and the antenna substrate 20 can be connected to each other by means of a simple structure. |
