| 发明名称 |
LIGHT EMITTING DEVICE |
| 摘要 |
A light emitting device comprises a package having a recess; a light emitting element mounted in the recess of the package; a light transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; and a fluorescent material contained in the sealing resin. The fluorescent material is distributed to a side of the light emitting element in a greater amount than to above the light emitting element, a side surface of the light emitting element is exposed to the sealing resin, and a portion of the light transmissive member protrudes from the sealing resin. |
| 申请公布号 |
US2017012185(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201615273298 |
申请日期 |
2016.09.22 |
| 申请人 |
NICHIA CORPORATION |
发明人 |
IWAKURA Daisuke |
| 分类号 |
H01L33/54;H01L33/62;H01L33/50 |
主分类号 |
H01L33/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a light emitting device comprising:
mounting a light emitting element in a recess of a package; disposing a light transmissive member above the light emitting element; and depositing a sealing resin so as to seal the recess of the package, the sealing resin containing a fluorescent material; wherein the fluorescent material is distributed to a side of the light emitting element in a greater amount than to above the light emitting element, wherein a side surface of the light emitting element is exposed to the sealing resin, and wherein a portion of the light transmissive member protrudes from the sealing resin. |
| 地址 |
Anan-shi JP |
