发明名称 |
Integrated Lens-Array-On-Substrate For Optical Coupling System And Fabrication Method Thereof |
摘要 |
An imprinting method for forming an integrated optical coupling device on wafer level may include: providing a substrate, with a reflection coating disposed thereon; providing an imprinting mold, with void regions shaped according to a designed lens profile; forming a molding material on the substrate; pressing the imprinting mold on the molding material on the substrate; curing the molding material into a cured molding material; removing the imprinting mold; depositing an anti-reflection film on the cured molding material; and dicing to form an integrated optical coupling device. |
申请公布号 |
US2017010427(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615272606 |
申请日期 |
2016.09.22 |
申请人 |
SiFotonics Technologies Co., Ltd. |
发明人 |
Shi Tuo;Yan Shipeng;Zhang Nai;Pan Dong |
分类号 |
G02B6/42;G02B6/293;G02B6/32 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
1. An imprinting method for forming an integrated optical coupling device on wafer level, comprising:
providing a substrate, with a reflection coating disposed thereon; providing an imprinting mold, with void regions shaped according to a designed lens profile; forming a molding material on the substrate; pressing the imprinting mold on the molding material on the substrate; curing the molding material into a cured molding material; removing the imprinting mold; depositing an anti-reflection film on the cured molding material; and dicing to form an integrated optical coupling device. |
地址 |
Grand Cayman KY |