| 摘要 |
A multilayer printed wiring board has an inner layer substrate, a first conductor pattern, a first insulating layer, a second conductor pattern, a second insulating layer, and via holes. The first conductor pattern is formed on the surface of the inner layer substrate, and the first insulating layer is formed of a first light-sensitive resin on the surface of the inner layer substrate so as to cover the first conductor pattern. The second conductor pattern is formed on the surface of the first insulating layer, and the second insulating layer is formed of a second light-sensitive resin on the portions of the first insulating layer other than those on which the second conductor pattern is formed. The via holes penetrate the first insulating layer so as to electrically connect the first conductor pattern and the second conductor pattern. |
