| 发明名称 |
LIGHT EMITTING DIODE PACKAGE |
| 摘要 |
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame. |
| 申请公布号 |
US2017012190(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201615276545 |
申请日期 |
2016.09.26 |
| 申请人 |
Seoul Semiconductor Co., Ltd. |
发明人 |
KIM Bang Hyun |
| 分类号 |
H01L33/64;H01L33/62;H01L33/50;H01L25/16;H01L27/02;H01L33/56;H01L33/48;H01L29/866 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) package, comprising:
a first lead frame and a second lead frame spaced apart from each other, the first lead frame and the second lead frame respectively comprising a first side and second side facing each other; at least one LED chip disposed on the first lead frame; a wire electrically connecting the LED chip and the second lead frame; and a housing disposed on the first lead frame and the second lead frame; wherein the first lead frame comprises a first protrusion in the first side and the second lead frame comprises a corresponding recess in the second side to increase a mechanical bonding strength with a housing, wherein at least one portion of the LED chip is disposed within the first protrusion. |
| 地址 |
Ansan-si KR |
