发明名称 |
TRENCH TO TRENCH FIN SHORT MITIGATION |
摘要 |
A semiconductor structure includes a replacement strap for a finFET fin that provides communication between a storage capacitor and the fin. The storage capacitor is located in a deep trench formed in a substrate and the fin is formed on a surface of the substrate. The replacement strap allows for electrical connection of the fin to the storage capacitor and is in direct physical communication with the fin and the storage capacitor. The replacement strap may be formed by removing a sacrificial strap and merging epitaxially grown material from the fin and epitaxially grown material from the capacitor. The epitaxially grown material grown from the fin grows at a slower rate relative to the epitaxially grown material grown from the capacitor. By removing the sacrificial strap prior to forming the replacement strap, epitaxial overgrowth that may cause shorts between adjacent capacitors is limited. |
申请公布号 |
US2017012047(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615273972 |
申请日期 |
2016.09.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Basker Veeraraghavan S.;Reznicek Alexander |
分类号 |
H01L27/108;H01L29/78 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor device comprising:
a finFET fin upon a substrate; a deep trench within the substrate; a capacitor within the deep trench, and; a replacement strap in contact with the fin and with the capacitor. |
地址 |
Armonk NY US |