发明名称 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
摘要 Provided is a resin composition including an allyl-group-containing compound (A) and a maleimide compound (B), in which the allyl-group-containing compound (A) has reactive functional groups other than allyl groups.
申请公布号 WO2017006891(A1) 申请公布日期 2017.01.12
申请号 WO2016JP69744 申请日期 2016.07.04
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 KASHIMA, Naoki;TOMIZAWA, Katsuya;ITO, Meguru;HAMAJIMA, Tomoki;SHIGA, Eisuke;TAKANO, Kentaro;KOGA, shota
分类号 C08F222/40;B32B15/08;C08G59/62;C08G73/06;C08J5/24;C08K3/22;C08K3/36 主分类号 C08F222/40
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