发明名称 SYSTEM FOR INSPECTING A BACKSIDE OF A WAFER
摘要 An inspection system for inspection a surface of a substrate, the inspection system may include an interface for holding the substrate; a movement mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of the different dark field illuminated parts does not include an image of the camera.
申请公布号 US2017010220(A1) 申请公布日期 2017.01.12
申请号 US201615207537 申请日期 2016.07.12
申请人 CAMTEK LTD. 发明人 Ben Ezer Zehava;Kafry Guy;Koren Shimon;Langmans Eldad;Deutsch Natan
分类号 G01N21/88;H04N5/225;G01N21/95;H04N7/18 主分类号 G01N21/88
代理机构 代理人
主权项 1. An inspection system for inspection a surface of a substrate, the inspection system comprises: an interface for holding the substrate; a moving mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of the different dark field illuminated parts does not include an image of the camera.
地址 Migdal-Haemek IL