| 摘要 |
The present invention provides an input device with which it is possible to reduce damage to a decorative layer formed on a panel when a flexible wiring board is thermocompression-bonded to the surface of the decorative layer. The decorative layer 21 is formed on the inner face 2b of a translucent panel 2 formed of a synthetic resin, and an inside resin layer 22 is formed on the surface of the decorative layer 21. A connection pattern 18 having electrical continuity to an electrode layer is formed on the surface 22b of the inside resin layer 22. A flexible wiring board 7 is thermocompression-bonded to the surface 22b of the inside resin layer 22, but the heat and pressure experienced during this process are absorbed by the inside resin layer 22, so that it becomes possible to reduce damage to the panel 2 of the decorative layer 21. |
