发明名称 FLUID SUPPLY PACKAGE
摘要 Fluid supply packages of varying types are described, which are useful for delivery of fluids to fluid-utilizing facilities such as semiconductor manufacturing facilities, solar panel manufacturing facilities, and flat-panel display manufacturing facilities. The fluid supply packages include fluid supply vessels and valve heads of varied configuration, as useful to constitute fluid supply packages that are pressure-regulated and/or adsorbent-based in character.
申请公布号 WO2017008039(A1) 申请公布日期 2017.01.12
申请号 WO2016US41578 申请日期 2016.07.08
申请人 ENTEGRIS, INC, 发明人 TOM, Glenn, M.;OLANDER, W., Karl;DIETZ, James, A.;WODJENSKI, Mechael, J.;STURM, Edward, A.;DIMASCIO, Susan, K.;WANG, Luping;MCMANUS, James, V.;LURCOTT, Steven, M.;ARNO, Jose, I.;MARGANSKI, Paul, J.;SWEENEY, Joseph, D.;WILSON, Shaun, M.;BISHOP, Steven, E.;NELSON, Greg;CARRUTHERS, J., Donald;YEDAVE, Sharad, N.;TANG, Ying;DESPRES, Joseph;CHAMBERS, Barry;RAY, Richard;ELZER, Daniel
分类号 F17C7/00;F16K17/04;F16K31/06;F17C13/04 主分类号 F17C7/00
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