| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured product which has high heat resistance, light resistance, and thermal shock resistance and improves, in particular, conduction characteristics and moisture absorption reflow resistance of an optical semiconductor device at a high temperature.SOLUTION: The curable epoxy resin composition contains an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by formula (1), and a peroxide decomposer (C). [In the formula, Rand Rare the same or different and each represent a hydrogen atom or a C1-C8 alkyl group.] |
