| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring board with excellent folding resistance, insulation reliability, and heat resistance.SOLUTION: A multilayer flexible wiring board (1) includes internal conductive layers (12a, 12b) and external conductive layers (14a, 14b) provided on the internal conductive layers (12a, 12b) via an adhesive resin hardener (13). The internal conductive layers (12a, 12b) and the external conductive layers (14a, 14b) are electrically connected via a blind (17). An alkali dissolution rate of the adhesive resin hardener is higher than or equal to 0.0001 μm/sec and lower than or equal to 0.01 μm/sec. A residual solvent quantity is less than or equal to 0.5 mass%. Tg (glass-transition temperature) is lower than or equal to 125°C. |
