| 摘要 |
This is to provide a wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer using the same, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, is compatible with the TSV formation and wafer back surface interconnect forming steps, allows for easy removal, and can heighten productivity of the thin wafer,
and the wafer processing laminate comprises a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer comprises a three-layered structure composite temporary adhesive material layer comprising a first temporary adhesive layer of a non-silicone thermoplastic resin layer (A) releasably adhered on a surface of the wafer, a second temporary adhesive layer of a thermoplastic siloxane resin polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and releasably adhered to the support. |
