发明名称 電子部品を内蔵する筐体の防水構造
摘要 PROBLEM TO BE SOLVED: To provide an easy-to-manufacture waterproof structure of a housing for incorporating an electronic component.SOLUTION: A waterproof structure of a housing for incorporating an electronic component includes a housing consisting of a first case, and a second case having a groove to be applied with an adhesive in the surface facing the first case, and an electronic component to be incorporated in the housing. The first case is provided, in the surface facing the second case, with a protrusion which comes into contact with the adhesive by intruding into the groove, when the first case and second case are attached to the surface facing the second case.
申请公布号 JP6058350(B2) 申请公布日期 2017.01.11
申请号 JP20120236144 申请日期 2012.10.25
申请人 京セラ株式会社 发明人 石橋 賢二;山口 彬
分类号 H05K5/06;H04M1/02 主分类号 H05K5/06
代理机构 代理人
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