| 摘要 |
There is a need to alleviate or reduce crosstalk between bonding wires or wires in a device substrate. One selection configuration divides a multiplexed terminal group into three groups according to functions differently from another selection configuration that divides the multiplexed terminal group into two groups. A first multi-pin semiconductor device is configured such that the groups are successively arranged along one edge of the chip. The first semiconductor device connects with a second semiconductor device via a multiplexed terminal group. The multiplexed terminal group includes first through third interface terminal groups that differ from each other in signal input/output configurations. |
