| 摘要 |
A lithography method including: a preparation, during which a resist layer is deposited on a substrate, and a preliminary lithography carried out to define at least one preliminary pattern in the resist layer, and during the preliminary lithography, a formation of at least one positioning mark forming a relief in the resist layer. The method further includes at least one subsequent lithography applied to the resist layer and including: a preliminary positioning including positioning a lithography mechanism as a function of the at least one positioning mark, and at least one formation of additional patterns in the resist layer using the lithography mechanism positioned as a function of the at least one positioning mark. |
