| 摘要 |
A manufacturing method of a carrier for a double-side polishing apparatus by performing a lapping process on the carrier for a double-side polishing apparatus, being gear shaped and having a holding hole to hold a semiconductor wafer; including: providing an outer carrier, being larger than the carrier for a double-side polishing apparatus in size, having a hole to hold the carrier for a double-side polishing apparatus, and being configured to arrange the center of the hole to be eccentric to the center of the outer carrier; holding the carrier for a double-side polishing apparatus by the outer carrier, with the carrier for a double-side polishing apparatus being put in the hole; and performing a lapping process on the carrier for a double-side polishing apparatus with the center of the hole being eccentric to the center of the outer carrier. |
