发明名称 Semiconductor device including a redistribution layer and metallic pillars coupled thereto
摘要 A semiconductor device and method of forming the same including, in one embodiment, a substrate (1105) and a plurality of source and drain regions (s, d) formed as alternating pattern on the substrate (1105). The semiconductor device also includes a plurality of gates (1150) formed over the substrate (1105) between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips (1111, 1121) formed in a first metallic layer above the substrate (1105) and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions.
申请公布号 EP2738806(A3) 申请公布日期 2017.01.11
申请号 EP20130194661 申请日期 2013.11.27
申请人 Enpirion, Inc. 发明人 Lotfi, Ashraf W.;Demski, Jeffrey;Feygenson, Anatoly;Lopata, Douglas Dean;Norton, Jay;Weld, John D.
分类号 H01L29/417;H01L21/285;H01L21/336;H01L21/768;H01L21/8238;H01L23/00;H01L23/31;H01L23/36;H01L23/482;H01L23/495;H01L23/522;H01L23/64;H01L27/02;H01L27/092;H01L29/08;H01L29/10;H01L29/45;H01L29/49;H01L29/66;H01L29/78 主分类号 H01L29/417
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