发明名称 |
Semiconductor device including a redistribution layer and metallic pillars coupled thereto |
摘要 |
A semiconductor device and method of forming the same including, in one embodiment, a substrate (1105) and a plurality of source and drain regions (s, d) formed as alternating pattern on the substrate (1105). The semiconductor device also includes a plurality of gates (1150) formed over the substrate (1105) between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips (1111, 1121) formed in a first metallic layer above the substrate (1105) and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions. |
申请公布号 |
EP2738806(A3) |
申请公布日期 |
2017.01.11 |
申请号 |
EP20130194661 |
申请日期 |
2013.11.27 |
申请人 |
Enpirion, Inc. |
发明人 |
Lotfi, Ashraf W.;Demski, Jeffrey;Feygenson, Anatoly;Lopata, Douglas Dean;Norton, Jay;Weld, John D. |
分类号 |
H01L29/417;H01L21/285;H01L21/336;H01L21/768;H01L21/8238;H01L23/00;H01L23/31;H01L23/36;H01L23/482;H01L23/495;H01L23/522;H01L23/64;H01L27/02;H01L27/092;H01L29/08;H01L29/10;H01L29/45;H01L29/49;H01L29/66;H01L29/78 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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