| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for effectively and efficiently removing a reductive gas remaining in a vacuum chamber after the end of the soldering in a soldering method using a reductive gas including a formic acid gas, and to provide a soldering device for the soldering method.SOLUTION: A soldering method using a reductive gas including carboxylic acid gas is characterized to include exhausting a gas in a vacuum chamber while causing an inactive gas to flow along a wall surface of the vacuum chamber in a cooling process for cooling a soldered member to be joined. A soldering device for the soldering method includes a vacuum chamber 10 having a heating stage 30 for mounting and heating members 31, 32 to be joined which are soldered with solder 35, carboxylic acid gas introduction means 25, inactive gas introduction means 27, air flow direction adjusting means 29 installed on an inlet part to the vacuum chamber 10 and gas exhaust means 26. |
