发明名称 基板処理装置および基板処理方法
摘要 One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber. The substrate is transported to the sub-transport mechanism in the sub-transport chamber by the main transport mechanism in another processing block, and is transported to the main transport mechanism in the indexer block by the sub-transport mechanism in the sub-transport chamber.
申请公布号 JP6058999(B2) 申请公布日期 2017.01.11
申请号 JP20120270506 申请日期 2012.12.11
申请人 株式会社SCREENセミコンダクターソリューションズ 发明人 稲垣 幸彦
分类号 H01L21/677;H01L21/027 主分类号 H01L21/677
代理机构 代理人
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