| 摘要 |
An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a first ejection actuator coupled to the door and configured to move simultaneously with the door, a second ejection actuator including a spring member connected to the second ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the second ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the second ejection actuator along the chassis enclosure. |
