| 摘要 |
[Object] To provide a semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof, and eventually reducing cost. [Solving Means] It includes a first chip 110 and a second chip 120, the first chip and the second chip being bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes 114, the first chip 110 transmitting signals obtained by time-discretizing analog signals generated by the respective sensors 111 to the second chip through the corresponding via holes, the second chip 120 having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals. |
