发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively. |
申请公布号 |
EP3116020(A1) |
申请公布日期 |
2017.01.11 |
申请号 |
EP20150759174 |
申请日期 |
2015.03.04 |
申请人 |
Rohm Co., Ltd. |
发明人 |
HAYASHI, Kenji;SUZAKI, Akihiro |
分类号 |
H01L21/52;H01L23/29;H01L25/07;H01L25/18 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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