Multilayer ceramic electronic component and board having the same mounted thereon

摘要

A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively.

主权项

1. A multilayer ceramic electronic component comprising:
a multilayer ceramic capacitor including
a ceramic body in which a plurality of dielectric layers are stacked,a pair of first external electrodes disposed on first and second side surfaces of the ceramic body, respectively,a pair of second external electrodes disposed on the first and second side surfaces of the ceramic body, respectively, wherein one of the first external electrodes and one of the second external electrodes disposed on the first side surface are spaced apart from each other in a length direction of the ceramic body and extended to portions of a mounting surface of the ceramic body, andfirst and second internal electrodes alternately stacked in the ceramic body, exposed through at least one of the first and second side surfaces of the ceramic body, and connected to one of the first and second external electrodes, one of the plurality of dielectric layers being disposed between the first and second internal electrodes; and an interposer substrate including
an insulation substrate connected to the mounting surface of the multilayer ceramic capacitor, andfirst and second connection terminals disposed on the insulation substrate and connected to the first and second external electrodes, respectively, wherein the first and second connection terminals of the interposer substrate comprise:
first and second connection portions disposed on an upper surface of the insulation substrate so as to be connected to the first and second external electrodes, respectively; andfirst and second terminal portions extended from a center of the first and second connection portions to a part of a lower surface of the insulation substrate through surfaces of the insulation substrate opposing each other in a length direction of the insulation substrate, respectively, and wherein each of the first and second connection portions extends to both opposing edges of the insulation substrate in a width direction of the insulation substrate orthogonal to the length direction of the insulation substrate, and corner parts of the insulation substrate between the first and second connection portions and the first and second terminal portions are provided with margins.