| 摘要 |
A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections. |
| 主权项 |
1. A multilayer circuit board, comprising:
a first substrate having a first side, a second side, a first pad, and a first circuit, wherein the first side and the second side are on opposite sides of the first substrate; the first pad is on the second side, and electrically connected to the first circuit, which is embedded in the first substrate; and a second substrate having a third side, a fourth side, a first through hole, a second pad, and a second circuit, wherein the third side and the fourth side are on opposite sides of the second substrate; the third side of the second substrate is laminated on the second side of the first substrate; the first through hole is opened at both the third side and the fourth side, and the first pad of the first substrate is in the first through hole; the second pad is on the fourth side, and electrically connected the second circuit, which is embedded in the second substrate. |
