发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes: semiconductor layer having an impurity region of a first conductivity type; a gate insulating layer, at least a part of the gate insulating layer positioned on the semiconductor layer; a gate electrode positioned on the gate insulating layer and having a first surface in contact with the part of the gate insulating film and a second surface opposite to the first surface; an interlayer insulating layer covering the gate electrode; and an electrode in contact with the impurity region. The gate electrode has a recess at a corner in contact with the second surface, in a cross section of the gate electrode perpendicular to a surface of the semiconductor layer. A cavity surrounded by the gate electrode and the interlayer insulating layer is positioned in a region including at least a part of the recess.
申请公布号 US9543427(B2) 申请公布日期 2017.01.10
申请号 US201514820555 申请日期 2015.08.07
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Kudou Chiaki;Sorada Haruyuki;Sano Tsuneichiro
分类号 H01L29/78;H01L29/08;H01L29/10;H01L29/423;H01L29/66;H01L21/3213;H01L21/02 主分类号 H01L29/78
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A semiconductor device comprising: a semiconductor layer having an impurity region of a first conductivity type; a gate insulating layer, at least a part of the gate insulating layer positioned on the semiconductor layer; a gate electrode positioned on the gate insulating layer and having a first surface in contact with the part of the gate insulating film and a second surface opposite to the first surface; an interlayer insulating layer covering the gate electrode; an electrode in contact with the impurity region; and a wiring positioned on the interlayer insulating layer and electrically connected to the electrode, wherein a part of the interlayer insulating layer is positioned between the gate electrode and the electrode, the gate electrode has a recess positioned at a corner in contact with the second surface of the gate electrode, in a cross section of the gate electrode perpendicular to a surface of the semiconductor layer, a cavity surrounded by the gate electrode and the interlayer insulating layer including the part of the interlayer insulating layer is positioned in a region including at least a part of the recess, a surface of the gate electrode defining the recess directly borders the cavity, and in the cross section of the gate electrode, a distance between an edge of the cavity in contact with the part of the interlayer insulating layer and a virtual center axis of the gate electrode is larger than or equal to a distance between an edge of the gate electrode at the first surface of the gate electrode and the virtual center axis of the gate electrode.
地址 Osaka JP