| 发明名称 | Semiconductor package structure | ||
| 摘要 | A semiconductor package structure includes a lead frame, a chip and a molding compound. The lead frame includes a tray pad and a plurality of leads. Two of the leads are different in height positions. The chip is disposed on the tray. The molding compound encapsulates the chip and a portion of each lead. | ||
| 申请公布号 | US9543237(B2) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201514747641 | 申请日期 | 2015.06.23 |
| 申请人 | ALI CORPORATION | 发明人 | Feng Lo-Tien |
| 分类号 | H01L23/495;H01L23/31 | 主分类号 | H01L23/495 |
| 代理机构 | Rabin & Berdo, P.C. | 代理人 | Rabin & Berdo, P.C. |
| 主权项 | 1. A semiconductor package structure connected to a circuit board, comprising: a lead frame, comprising: a tray; anda plurality of leads, wherein each lead has an inner lead, and two of the inner leads are different in height position; a chip disposed on the tray and electrically connected to the circuit board through a plurality of bonding wires and the plurality of leads; and a molding compound encapsulating the chip and the inner lead of each lead. | ||
| 地址 | Hsinchu TW | ||