发明名称 Microphone with built-in speaker driver
摘要 A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.
申请公布号 US9544673(B2) 申请公布日期 2017.01.10
申请号 US201414580041 申请日期 2014.12.22
申请人 INVENSENSE, INC. 发明人 Lewis Jerad M.;Schreier Paul M.;Harney Kieran P.;LeMaire Joshua C.;Khenkin Aleksey S.
分类号 H04R1/04;H04R17/00;H04R19/00;H04R19/04 主分类号 H04R1/04
代理机构 Amin, Turocy & Watson, LLP 代理人 Amin, Turocy & Watson, LLP
主权项 1. A microphone package, comprising: a microphone application-specific integrated circuit (ASIC), coupled to a microphone transducer, that generates a digital audio output signal based on sensing an acoustical signal; and a speaker driver that generates, based on a digital audio input signal, a drive signal employable to drive a speaker, wherein a first frequency of a first charge pump utilized by the speaker driver is synchronized with a second frequency of a second charge pump utilized by the microphone transducer.
地址 San Jose CA US