Method for producing an optoelectronic component and optoelectronic component produced in such a way

摘要

A semiconductor chip without a substrate is provided on an electrically insulating carrier. The carrier has electrically conductive contact metallizations. Furthermore, an electrically conductive carrier substrate and a covering substrate are provided. The covering substrate has electrically conductive contact structures. The carrier is attached to the carrier substrate. Subsequently, the covering substrate is attached to the semiconductor chip and/or to the carrier. The electrically conductive contact structures are connected in an electrically conductive manner to the electrically conductive contact metallizations and the electrically conductive carrier substrate.

主权项

1. A method for producing an optoelectronic component, the method comprising:
providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface, the electrically conductive contact metallizations being insulated from one another; providing an electrically conductive carrier substrate; providing a covering substrate that has a plurality of electrically conductive contact structures that are electrically insulated from one another; applying the electrically insulating carrier with the optoelectronic semiconductor chip arranged thereon on the electrically conductive carrier substrate; applying the covering substrate on the optoelectronic semiconductor chip and/or on the mounting surface of the electrically insulating carrier; and electrically conductively connecting the electrically conductive contact structures to the electrically conductive contact metallizations and the electrically conductive carrier substrate by folding over the contact structures of the covering substrate.