| 发明名称 | Method and apparatus for baking photoresist patterns | ||
| 摘要 | In accordance with some embodiments, a method and an apparatus for baking photoresist patterns are provided. The method includes putting a wafer over a heating assembly. A photoresist pattern is formed over a top surface of the wafer. The method further includes curing the wafer from the top surface of the wafer by a curing assembly while heating the wafer from a bottom surface of the wafer by a heating assembly. | ||
| 申请公布号 | US9541836(B2) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201414176314 | 申请日期 | 2014.02.10 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. | 发明人 | Lin Chin-Min;Huang De-Fang;Tsao Ching-Hui |
| 分类号 | F27B5/14;H01L21/67;H01L21/66;H01L21/027;G03F7/40;H01L21/677;F27B17/00 | 主分类号 | F27B5/14 |
| 代理机构 | McClure, Qualey & Rodack, LLP | 代理人 | McClure, Qualey & Rodack, LLP |
| 主权项 | 1. A method for baking a wafer, comprising: putting a wafer over a heating assembly, wherein a photoresist pattern is formed over a top surface of the wafer; moving down a curing assembly to be close to the top surface of the wafer by a support arm moving down a cap, wherein the cap is positioned over the heating assembly and connected to the support arm, and the curing assembly is fixed in the cap; and curing the wafer from the top surface of the wafer by the curing assembly while heating the wafer from a bottom surface of the wafer by the heating assembly. | ||
| 地址 | Hsin-Chu TW | ||