发明名称 Backlight image sensor chip having improved chip driving performance
摘要 The present invention relates to a backlight image sensor chip having improved chip driving performance, in which a region other than a pad region, on which a conductive pad is formed, and a sensing region, on which an optical filter is formed, is used as a region for auxiliary driving so that additional functions such as auxiliary power supply, auxiliary signal transmission and auxiliary operation control can be performed, without additional process, in the backlight image sensor chip having a restricted area, thereby improving the chip driving performance.
申请公布号 US9543348(B2) 申请公布日期 2017.01.10
申请号 US201414912373 申请日期 2014.08.12
申请人 SILICONFILE TECHNOLOGIES INC. 发明人 Park Kyoung-Sik;Ahn Heui Gyun;Ko Min-Suk;Cho Gab-Hwan
分类号 H01L31/0232;H01L27/146 主分类号 H01L31/0232
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A backlight image sensor having improved chip driving performance, which includes an element stacked unit having a semiconductor substrate, a semiconductor circuit module formed on a front side of the semiconductor substrate, an image sensor module and an interlayer insulation layer, an insulation multi-layer formed on a back side of the semiconductor substrate, a conductive pad formed on a portion of the back side of the insulation multi-layer, and a coupling unit electrically coupled between the conductive pad and the semiconductor circuit module of the element stacked unit, comprising: at least one routing metal formed in a region of a same layer as the conductive pad, and being electrically coupled to and directly contacting the conductive pad; at least one auxiliary driving unit formed in the element stacked unit or the insulation multi-layer; and an auxiliary coupling unit being electrically coupled between the at least one routing metal and the at least one auxiliary driving unit.
地址 Gyeonggi-do KR