Hybrid package transmission line circuits

摘要

“Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

主权项

1. A package transmission line circuit, comprising:
a first conductive trace defining a routing path on a first interconnect level of a package substrate; a second conductive trace co-located with the first conductive trace on a second interconnect level of the package substrate separated from the first interconnect level by a first dielectric material disposed there between; a plurality of vias extending through the first dielectric material and electrically coupling the first and second traces; and a plated through hole formed in a layer of the package substrate below the second conductive trace and electrically coupled to the second conductive trace by a via proximate to a first end of the routing path.