发明名称 Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement
摘要 A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.
申请公布号 US9543221(B2) 申请公布日期 2017.01.10
申请号 US201514937347 申请日期 2015.11.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Park Dae-seo;Lee Ka-ram;Kim Choo-ho
分类号 H01L21/20;H01L21/66;H01L33/58;H01L33/54 主分类号 H01L21/20
代理机构 Muir Patent Law, PLLC 代理人 Muir Patent Law, PLLC
主权项 1. A method of manufacturing a light-emitting apparatus, the method comprising: disposing a substrate on a support; disposing a light-emitting package on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate, the light-emitting package comprising a light-emitting device; applying energy to the light-emitting package to make the light-emitting device emit light; and determining a position where the light-emitting package is actually disposed by analyzing the light that is emitted from the light-emitting device due to the energy.
地址 Yeongtong-gu, Suwon-si, Gyeonggi-do KR