Light emitting device

摘要

Disclosed is a light emitting device. The light emitting device includes a body, first and second metal layers on a top surface of the body, a heat radiation plate disposed between the first and second metal layers and having a circular outline, a plurality of light emitting parts on the heat radiation plate, first and second bonding regions disposed on the first and second metal layers and electrically connected with the light emitting parts, and a molding member disposed on the heat radiation plate to cover the light emitting parts. Each of the light emitting parts includes a plurality of light emitting chips connected with each other, and a plurality of wires to electrically connect the light emitting chips with the first and second bonding regions, and the wires of each light emitting part are arranged a radial direction about a central of the heat radiation plate.

主权项

1. A light emitting device comprising:
a body; first and second metal layers on a top surface of the body; a heat radiation plate disposed between the first and second metal layers and having a circular outline; a plurality of light emitting parts on the heat radiation plate; first and second bonding regions disposed on the first and second metal layers and electrically connected with the light emitting parts; and a molding member disposed on the heat radiation plate to cover the light emitting parts, wherein each of the light emitting parts includes a plurality of light emitting chips connected with each other, and a plurality of wires to electrically connect the light emitting chips with the first and second bonding regions, and the wires of each light emitting part are disposed in a radial direction with respect to a center axis of the heat radiation plate, wherein the light emitting parts include a first light emitting part disposed in a first region of the heat radiation plate, a first light emitting chip adjacent to the first metal layer; a first wire connected between the first light emitting chip and the first bonding region of the first metal layer; and a connection member between the first light emitting chip and a third light emitting chip adjacent to the first light emitting chip; wherein the first wire is arranged in parallel to a first side of the first light emitting chip, and wherein the connection member is arranged in parallel to a second side of the first light emitting chip.