| 摘要 |
Disclosed herein, amongst other things is a component (100, 200, 300, 400, 500, 600, 700, 800, 900, 1000) of a molding system (402) (e.g. mold component, post-mold component, etc.) having a heat dissipater (130, 230, 330, 430, 530, 630, 730, 830, 930, 1030) that is configured to impart a profiled heat removal rate on a selected portion of a molded article (120, 220, 320, 420) that generally matches a heat distribution therein. |
| 主权项 |
1. A component of a molding system, wherein:
a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein, wherein the profiled heat removal rate is configured to vary with a thickness of the selected portion of the molded article, whereby selective cooling rates with higher rates are directed to the slower cooling sections that correspond with thicker parts of the molded article, and lower cooling rates are directed at the faster cooling section that correspond with relatively thinner sections of the molded article; the heat dissipater defines a flow guide with which to guide a flow of a treatment fluid over the selected portion of the molded article, wherein the flow guide has a profile that varies such that its separation distance to the molded article varies inversely to a thickness of the selected portion of the molded article. |
