Stress released image sensor package structure and method

摘要

A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and configured to generate one or more signals in response to light incident on the first surface. A plurality of contact pads are formed at the first surface and are electrically coupled to the plurality of photo detectors. A plurality of holes are each formed into the second surface and extending through the substrate to one of the contact pads. Conductive leads each extend from one of the contact pads, through one of the plurality of holes, and along the second surface. The conductive leads are insulated from the substrate. One or more trenches are formed into a periphery portion of the substrate each extending from the second surface to the first surface. Insulation material covers sidewalls of the one or more trenches.

主权项

1. A sensor package, comprising:
a first substrate with opposing first and second surfaces, a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate, a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors, a plurality of holes each formed into the second surface of the first substrate and extending through the first substrate to one of the contact pads, and conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate, wherein the conductive leads are insulated from the first substrate; one or more trenches formed into a periphery portion of the first substrate each extending from the second surface to the first surface; and insulation material covering sidewalls of the one or more trenches.