| 发明名称 |
Adhesive composition and adhesive tape |
| 摘要 |
The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition. |
| 申请公布号 |
US9540550(B2) |
申请公布日期 |
2017.01.10 |
| 申请号 |
US201214431815 |
申请日期 |
2012.09.29 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Wu Qing;Li Zhou;Qin Liang;Kong Fanwang;Wan Hongmei |
| 分类号 |
C08F2/50;C08F2/46;C08G61/04;B32B9/00;C09J163/00;C09J7/02 |
主分类号 |
C08F2/50 |
| 代理机构 |
|
代理人 |
Kling Janet A.;Rosenblatt Gregg H. |
| 主权项 |
1. A thermally conductive adhesive composition, based on the total weight of the composition, comprising:
(a) 15-45% by weight of an epoxy component; (b) 20-40% by weight of electrically insulating, thermally conductive material; (c) 0.5-4% by weight of a photoinitiator; (d) 5-25% by weight of a thermoplastic polymer; (e) 1-5% by weight of a hydroxyl-functional component; and (f) 1-25% by weight of a halogen-free flame retardant. |
| 地址 |
Saint Paul MN US |
