| 发明名称 | Surface-mount electronic component | ||
| 摘要 | A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate. | ||
| 申请公布号 | US9543247(B1) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201615051158 | 申请日期 | 2016.02.23 |
| 申请人 | STMicroelectronics (Tours) SAS | 发明人 | Ory Olivier |
| 分类号 | H01L23/52;H01L29/06;H01L29/16;H01L23/528;H01L21/306;H01L21/304;H01L21/302;H01L21/768;H01L21/78 | 主分类号 | H01L23/52 |
| 代理机构 | Gardere Wynne Sewell, LLP | 代理人 | Gardere Wynne Sewell, LLP |
| 主权项 | 1. A surface-mount integrated circuit chip, comprising: a substrate having a front surface and a side; at least one metallization configured to be soldered to an external device, said at least one metallization comprising a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate; and a porous silicon region included in the substrate and separating the second portion of the metallization from a remainder of the substrate. | ||
| 地址 | Tours FR | ||