Optoelectronic packages having through-channels for routing and vacuum

摘要

A stacked optoelectronic packaged device includes a plurality of stacked components within a package material having a package body providing side walls and a bottom wall for the package, and a lid which seals a top of the package. The stacked components include a first cavity die having a top surface and a bottom surface including at least one through-channel formed in the bottom surface. A bottom die has a top surface including at least one electrical trace and a light source die thereon. At least one of the through-channels of the first cavity die are aligned to the electrical trace, and the first cavity die is bonded to the bottom die with the electrical trace being within the through-channel and not contacting the first cavity die to provide a vacuum sealing structure. A photodetector (PD) is optically coupled to receive the light originating from the light source.

主权项

1. A stacked optoelectronic packaged device, comprising:
a plurality of stacked components within a package comprising a package material having a package body providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
a first cavity die having a cavity, a top surface and a bottom surface including at least one through-channel formed in said bottom surface, each through channel extending from the cavity to an outer edge of the first cavity die;a bottom die having a top surface including thereon at least one electrical trace and a light source die for emitting light coupled to said electrical trace, wherein the light source is within the cavity and the at least one electrical trace extends on said top surface of the bottom die from a bond pad within the cavity to a bond pad outside of the outer edge of the first cavity die;wherein at least one of said through-channels of said first cavity die is aligned to said electrical trace;wherein said first cavity die is bonded to said bottom die;wherein said electrical trace is within said through-channel and not contacting said first cavity die to provide, with an epoxy, an inner vacuum sealing structure, and a photodetector (PD) die optically coupled to receive said light originating from said light source die.