Optoelectronic assembly incorporating an optical fiber alignment structure

摘要

Device assemblies that include one or more optoelectronic devices incorporating one or more polymer-based fiber alignment structures are described. In accordance with some embodiments, the device assemblies can be fabricated using Embedded Wafer-Level Packaging (eWLP) methods. Each of the polymer-based fiber alignment structures operates as a stationary guiding structure for automatically guiding an optical fiber into optical alignment with a light propagating portion of the optoelectronic device when the optical fiber is inserted into a hollowed central portion of the polymer-based fiber alignment structure, the hollowed central portion having sloping sides.

主权项

1. An assembly comprising:
an optoelectronic device comprising a light propagating portion; a board having a pre-alignment hole extending through the board from a top major surface to a bottom major surface, the board arranged with respect to the optoelectronic device such that the pre-alignment hole is substantially aligned with the light propagating portion of the optoelectronic device; and a polymer-based fiber alignment structure located between the board and the optoelectronic device, the polymer-based fiber alignment structure comprising a tapered portion that is operative as a stationary guiding structure for automatically guiding an optical fiber into optical alignment with the light propagating portion of the optoelectronic device when the optical fiber is inserted via the pre-alignment hole of the board into the tapered portion of the polymer-based fiber alignment structure.