Semiconductor structure and manufacturing method thereof

摘要

A semiconductor structure includes a three dimensional stack including a first semiconductor die and a second semiconductor die. The second semiconductor die is connected with the first semiconductor die with a bump between the first semiconductor die and the second semiconductor die. The semiconductor structure includes a molding compound between the first semiconductor die and the second semiconductor die. A first portion of a metal structure over a surface of the three dimensional stack and contacting a backside of the second semiconductor die and a second portion of the metal structure over the surface of the three dimensional stack and configured for electrically connecting the three dimensional stack with an external electronic device.

主权项

1. A semiconductor structure, comprising:
a substrate and a first circuit on the substrate; a metal structure comprising an active portion and a dummy portion, the active portion electrically coupled with the first circuit through a conductive plug, the dummy portion not being electrically coupled with any circuitry, the active portion and the dummy portion being on a same level of the metal structure; a semiconductor die bonded to the substrate through a first active bump via a conductive pad on an active surface of the semiconductor die, a passive surface of the semiconductor die contacting the dummy portion of the metal structure, wherein the passive surface is opposite to the active surface; a dummy bump connected to the dummy portion of the metal structure; and a molding compound between the substrate and the active surface of the semiconductor die and surrounding the conductive plug; wherein the dummy bump is surrounded by ambient air.