| 发明名称 |
Wafer die separation |
| 摘要 |
A method of singulating a wafer starts with fracturing the wafer. The method may also include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet. |
| 申请公布号 |
US9543206(B2) |
申请公布日期 |
2017.01.10 |
| 申请号 |
US201514985705 |
申请日期 |
2015.12.31 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Yano Genki |
| 分类号 |
H01L21/00;H01L21/78;H01L21/687;H01L21/683;H01L21/67 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
Brill Charles A.;Cimino Frank D. |
| 主权项 |
1. A method of singulating a wafer and separating die that are supported on a dicing tape sheet comprising:
fracturing wafer to form a plurality of singulation lines dividing the wafer into a plurality of dies; attaching the dicing tape sheet to a ring frame; relatively raising a portion of the sheet supporting the wafer with respect to the ring frame; and attaching a plurality of radially extending strips of support tape to the ring frame and the dicing tape sheet. |
| 地址 |
Dallas TX US |
