| 发明名称 |
Structures for z-axis interconnection of multilayer electronic substrates |
| 摘要 |
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom. |
| 申请公布号 |
US9545017(B2) |
申请公布日期 |
2017.01.10 |
| 申请号 |
US201414183488 |
申请日期 |
2014.02.18 |
| 申请人 |
Ormet Circuits, Inc.;Integral Technology, Inc. |
发明人 |
Hunrath Christopher A;Tran Khang Duy;Shearer Catherine A;Holcomb Kenneth C;Friesen G Delbert |
| 分类号 |
H01L21/48;H05K3/40;H05K3/46 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
Brustein Mitchell |
| 主权项 |
1. An electronic substrate z-axis interconnection structure comprising:
a. a bonding film comprising:
i. a reinforcing matrix of c-stage thermosetting resin surrounded by a b-stage thermosetting resin; andii. optionally, a particulate filler; b. at least one hole traversing the bonding film, wherein the at least one hole is filled with a conductive paste. |
| 地址 |
San Diego CA US |
