Shielding encapsulation for electrical circuitry

摘要

An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.

主权项

1. An electromagnetic interference shielded device, comprising:
an electrical circuit comprising a radio frequency module or a digital module; a conforming dielectric layer disposed on at least a portion of the electrical circuit; an electrically non-conductive encapsulant layer disposed on at least a portion of the dielectric layer and disposed on the radio frequency module or the digital module of the electrical circuit, the dielectric layer being between the electrical circuit and the electrically non-conductive encapsulant layer, the electrically non-conductive encapsulant layer comprising a substantially planar encapsulant-air interface and an encapsulant-dielectric interface, the encapsulant-air interface extending across the electrically non-conductive encapsulant layer; and a plurality of particles anisotropically dispersed within the electrically non-conductive encapsulant layer such that a particle concentration along the substantially planar encapsulant-air interface is higher than a particle concentration along the encapsulant-dielectric interface, the plurality of particles comprising a Nickel-Manganese (NiMn) ferrite material or polyacetylene, wherein the particle concentration at the encapsulant-air interface is sufficiently high to provide electromagnetic interference protection to the electrical circuit and the particle concentration at the encapsulant-dielectric interface is sufficiently low to provide short-circuit protection of the electrical circuit along the encapsulant-dielectric interface.