Semiconductor package and fabricating method thereof

摘要

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

主权项

1. A semiconductor device comprising:
a redistribution structure comprising:
an upper redistribution layer comprising:
a first dielectric layer comprising a first dielectric material; anda first conductive trace; anda lower redistribution layer comprising:
a second dielectric layer comprising a second dielectric material; anda second conductive trace electrically coupled to the first conductive trace; a first semiconductor die attached to an upper side of the redistribution structure; a second semiconductor die attached to the upper side of the redistribution structure; a first mold material covering at least the upper side of the redistribution structure and a respective lateral side of each of the first and second semiconductor die; a substrate comprising an upper substrate side attached to a lower side of the redistribution structure; and a second mold material covering at least the upper substrate side, a lateral side of the first mold material, and a lateral side of the redistribution structure.