| 发明名称 | Method for shaping a laminate substrate | ||
| 摘要 | A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate. | ||
| 申请公布号 | US9543253(B2) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201514598258 | 申请日期 | 2015.01.16 |
| 申请人 | GLOBALFOUNDRIES INC. | 发明人 | Blackshear Edmund;Lombardi Thomas E.;Merte Donald A.;Ostrander Steven P.;Weiss Thomas;Zheng Jiantao |
| 分类号 | B23K1/00;B23K1/20;B23K31/00;B23K31/02;B23K37/04;H01L21/00;H01L23/00;H01L21/66;H01L21/673 | 主分类号 | B23K1/00 |
| 代理机构 | Heslin Rothenberg Farley & Mesiti P.C. | 代理人 | Heslin Rothenberg Farley & Mesiti P.C. ;Blasiak George |
| 主权项 | 1. A method comprising: providing a laminate substrate; characterizing the laminate substrate for warpage characteristics; determining a horizontal plane distortion based on the warpage characteristics; placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located centered between all sides of the laminate substrate, wherein the adjustment directly contacts a bottom surface of the laminate substrate; fluxing the laminate substrate; placing a chip onto the laminate substrate; and placing the fixture into a reflow furnace to join the chip and the laminate substrate. | ||
| 地址 | Grand Cayman KY | ||